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Welcome Message

Dear Researchers and Industry Colleagues,

On behalf of the Program Committee, we are delighted to welcome you to the 2nd International Asia Pacific Atomic Layer Deposition Conference (AP-ALD 2026).

It is our great pleasure to invite you to AP-ALD 2026, and we sincerely appreciate your continued interest and support.

Since the successful launch of the 1st AP-ALD Conference in Shanghai, China, in 2024, AP-ALD has served as a platform where researchers from academia, industry, and research institutes can share the latest scientific and technological advances in the field of Atomic Layer Deposition (ALD).

AP-ALD 2026 will be held from October 28 to 30, 2026, at Grand Hyatt Jeju, Korea, as an international conference covering both the fundamentals and applications of ALD technologies.

The conference program will include ALD fundamentals, process technologies, and emerging applications in next-generation semiconductor, display, and energy devices, as well as related technologies such as Atomic Layer Etching (ALE).

We hope AP-ALD 2026 will further strengthen academic exchange and collaboration within the Asia-Pacific ALD community. We warmly invite you to join us and share your valuable insights and experiences.

We look forward to welcoming you to Jeju.

Thank you.

Program Chair
Prof. Soo-Hyun Kim,Ulsan National Institute of Science and Technology (UNIST), Korea

Program Co-Chair
Prof. Yongfeng Mei,Fudan University, China